The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2011
Filed:
Jul. 29, 2004
Tammy Cheng, Midland, MI (US);
Mark Dobrzelewski, Midland, MI (US);
Daniel Solomon, Midland, MI (US);
Christopher Windiate, Kawkawlin, MI (US);
Tammy Cheng, Midland, MI (US);
Mark Dobrzelewski, Midland, MI (US);
Daniel Solomon, Midland, MI (US);
Christopher Windiate, Kawkawlin, MI (US);
Dow Corning Corporation, Midland, MI (US);
Abstract
A process for fabricating an electronic component includes a liquid injection molding method for overmolding a semiconductor device. The liquid injection molding method includes: i) placing the semiconductor device in an open mold, ii) closing the mold to form a mold cavity, iii) heating the mold cavity, iv) injection molding a curable liquid into the mold cavity to overmold the semiconductor device, v) opening the mold and removing the product of step iv), and optionally vi) post-curing the product of step v). The semiconductor device may have an integrated circuit attached to a substrate through a die attach adhesive.