The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2011
Filed:
Mar. 09, 2009
Yoshihiko Ino, Miyazaki, JP;
Yoshihiko Ino, Miyazaki, JP;
Oki Semiconductor Co., Ltd., Tokyo, JP;
Abstract
In a double-sided electrode package, a sealing resin layer is formed so as to fill peripheries of surface-side terminals formed on a package substrate. Since the side surfaces of the surface-side terminals have plural protruded rims, adhesion with the sealing resin layer is improved by an anchor effect. At a sealing step, since supplied liquid resin is naturally flowed to form the sealing resin layer, a 'mold step' and a 'grinding step' may be omitted, and thus the sealing step may be simplified more greatly than a case where the resin sealing is carried out by a transfer molding method.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile