The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2011

Filed:

Jun. 02, 2006
Applicant:

Mitsuo Usami, Tachikawa, JP;

Inventor:

Mitsuo Usami, Tachikawa, JP;

Assignee:

Hiachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An IC tag inlet () is configured by: an upper side antenna () and a lower side antenna () sandwiching a semiconductor chip () that includes an upper electrode () and a lower electrode () from both upper and lower directions; and a support resin () covering the semiconductor chip (). The semiconductor chip () is a micro chip having an outer size of 0.15 mm square or smaller, and a thickness of 10 μm or smaller. In a manufacturing process of the IC tag inlet (), in order to make the handling of the semiconductor chip () easy, prior to a step of sandwiching the semiconductor chip () between the upper side antenna () and the lower side antenna (), the whole surface of the semiconductor chip () is covered by the support resin (), so that an effective volume is made large.


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