The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2011
Filed:
Nov. 24, 2008
Kevin W. Lim, Sunnyvale, CA (US);
Seah S. Too, San Jose, CA (US);
Azlina N. Nayan, Kedah, ML;
Kee Hean Keok, Pulau Penang, ML;
Soon Tatt Ow Yong, Penang, ML;
Kevin W. Lim, Sunnyvale, CA (US);
Seah S. Too, San Jose, CA (US);
Azlina N. Nayan, Kedah, ML;
Kee Hean Keok, Pulau Penang, ML;
Soon Tatt Ow Yong, Penang, ML;
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
Various methods and apparatus for holding a semiconductor chip package are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first plate adapted to hold a semiconductor chip package. The semiconductor chip package includes a carrier substrate and at least one semiconductor chip coupled to the carrier substrate. A second plate is formed with a first opening defining an interior peripheral surface adapted to compress an outer edge of the carrier substrate between the first plate and the second plate without engaging the at least one semiconductor chip.