Development method, method of manufacturing photomask, and method of manufacturing semiconductor device

Abstract

A development method according to an embodiment includes exposing a photosensitive film formed on a substrate at a predetermined exposure amount, carrying out a first development process that develops the exposed photosensitive film at a predetermined first development condition so as to leave the photosensitive film, obtaining a sensitivity information of an unexposed photosensitive film on the substrate from a film thickness reduction of the photosensitive film developed by the first development process and the predetermined exposure amount, predicting pattern dimensions of multiple types of patterns to be formed when a second development process is carried out following the first development process from the sensitivity information, and determining a first acceptable range of a development condition in the second development process, determining a second acceptable range of the development condition in the second development process from the first acceptable range and a variation amount of pattern dimensions between the multiple types of patterns after the second development process and determining a second development condition in the second development process so as to satisfy both of the first and second acceptable ranges. The development method is used for forming a mask pattern on a photomask, which is then used for patterning a wafer in the manufacturing of a semiconductor device.