The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2011
Filed:
Jun. 28, 2006
Yoshiaki Shinjo, Kawasaki, JP;
Yuzo Shimobeppu, Kawasaki, JP;
Kazuo Teshirogi, Kawasaki, JP;
Kazuhiro Yoshimoto, Kawasaki, JP;
Yoshiaki Shinjo, Kawasaki, JP;
Yuzo Shimobeppu, Kawasaki, JP;
Kazuo Teshirogi, Kawasaki, JP;
Kazuhiro Yoshimoto, Kawasaki, JP;
Fujitsu Semiconductor Limited, Yokohama, JP;
Abstract
A film bonding method of bonding a die bond film without causing any breakage. The die bond film is pressed against a wafer having a surface protective tape bonded thereto using a film-setting roller and a film-bonding roller, and a laser beam having a predetermined shape is irradiated to an area between the rollers. While rotationally moving the film-setting roller and the film-bonding roller, the laser beam is scanned on the wafer in accordance with their motion, and a portion of the die bond film, melted by the laser beam, is pressed against the wafer by the film-bonding roller following the film-setting roller to bond the die bond film to the wafer. Since the die bond film is bonded to the wafer by melting the same by the laser beam, even if the wafer is thin and reduced in its strength, it is possible to avoid the wafer from being damaged e.g. by thermal contraction of the surface protective tape.