The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2011
Filed:
Jun. 21, 2007
Dae-ho Lee, Chungchungnam-do, KR;
Dae-Ho Lee, Chungchungnam-do, KR;
Samsung Electronics Co., Ltd., Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Abstract
In one embodiment, a circuit substrate comprises a substrate; and a warpage preventing pattern disposed on the substrate. The warpage preventing pattern comprises a first pattern at a first corner of the substrate and a second pattern at a second corner of the substrate. The first corner and the second corner are disposed adjacent to each other. An overall orientation of the first pattern is different from an overall orientation of the second pattern with respect to the substrate. The warping of a semiconductor package can be significantly reduced by cutting off stress lines in the corners of the circuit substrate. Various configurations and orientations of the warpage preventing pattern are provided in order to effectively block stress concentration in the corners of the circuit substrate.