The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2011

Filed:

Feb. 13, 2009
Applicants:

Takeo Kasuga, Sendai, JP;

Takashi Mizukoshi, Sendai, JP;

Koji Sakata, Sendai, JP;

Takeshi Saito, Sendai, JP;

Inventors:

Takeo Kasuga, Sendai, JP;

Takashi Mizukoshi, Sendai, JP;

Koji Sakata, Sendai, JP;

Takeshi Saito, Sendai, JP;

Assignee:

NEC Tokin Corporation, Sendai-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a solid electrolytic capacitor, a capacitor element laminate formed by stacking capacitor elements each using a valve metal as an anode body is bonded to a substrate by a conductive adhesive and packaged by a resin portion. The substrate includes a printed substrate made of an epoxy resin. On its mounting surface for the capacitor element laminate, there are provided an anode mounting portion and a cathode mounting portion each made of a copper base material. The anode mounting portion and the cathode mounting portion are electrically connected to an external anode terminal and an external cathode terminal, respectively, formed on the mounting surface of the solid electrolytic capacitor, through anode vias and cathode vias each penetrating through the epoxy resin. A part of the anode mounting portion on the substrate () extends to the outside of the packaging resin portion.


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