The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2011
Filed:
Jul. 28, 2009
Kultaransingh N. Hooghan, Murphy, TX (US);
John W. Osenbach, Kutztown, PA (US);
Brian Dale Potteiger, Reading, PA (US);
Poopa Ruengsinsub, Bangkok, TH;
Richard L. Shook, Fogelsville, PA (US);
Prakash Suratkar, Bangalore, IN;
Brian T. Vaccaro, Mertztown, PA (US);
Kultaransingh N. Hooghan, Murphy, TX (US);
John W. Osenbach, Kutztown, PA (US);
Brian Dale Potteiger, Reading, PA (US);
Poopa Ruengsinsub, Bangkok, TH;
Richard L. Shook, Fogelsville, PA (US);
Prakash Suratkar, Bangalore, IN;
Brian T. Vaccaro, Mertztown, PA (US);
LSI Corporation, Milpitas, CA (US);
Abstract
A method of fabricating an interconnection between a region of copper material and a conducting region is disclosed. The method includes a step of forming a region of tin material and a step of forming a region of nickel material. The method also includes a step of melting the tin material to induce formation of a nickel/tin/copper intermetallic composition at an interface between the region of copper material and the conducting region. The region of tin material and the region of nickel material define the interface between the region of copper material and the conducting region.