The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2011

Filed:

Jul. 01, 2009
Applicants:

Kyoung-il Park, Osan-si, KR;

Jin-won Lee, Yongin-si, KR;

Sun-hong Kim, Incheon, KR;

Min-sik Kim, Seoul, KR;

Ji-na Lee, Siheung-si, KR;

Inventors:

Kyoung-Il Park, Osan-si, KR;

Jin-Won Lee, Yongin-si, KR;

Sun-Hong Kim, Incheon, KR;

Min-Sik Kim, Seoul, KR;

Ji-Na Lee, Siheung-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
Abstract

Provided is a side view light emitting diode package including a housing that includes a front side part and a rear side part integrally formed with the front side part, the front side part having a light emission part; and a lead frame that is located between the front side part and the rear side part, wherein the lead frame includes a first lead connected to a first electrode of a Light Emitting Diode (LED) chip and a second lead connected to a second electrode of the LED chip, wherein the front side part includes a first groove, a second groove, and a third groove, wherein the first lead and the second lead are extended through the first groove and the second groove, respectively, and a heat dissipation part is extended from the first lead through the third groove to an outside of the LED package.


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