The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2011
Filed:
May. 07, 2010
Ming-tan Hsu, Taoyuan, TW;
I-cheng Shih, Taoyuan, TW;
Ming-Tan Hsu, Taoyuan, TW;
I-Cheng Shih, Taoyuan, TW;
Chunghwa Picture Tubes, Ltd., Taoyuan, TW;
Abstract
The present invention provides a bonding structure of circuit substrates for instant circuit inspecting. The connecting wire design of the bonding structure has an instant inspection ability of circuit connection in bonding two circuit substrates. In two bonded circuit substrates, the signal inputted at the circuit part passes the conductive particles to the first connecting wire, and then passes the conductive particles again to the detecting part from the first connecting wire. Therefore, measuring the output signal can inspect the reliability of the circuit connection of the bonded circuit substrates. If the output signal is the same as the input signal, the bonding structure between the first connecting wire and the circuit part is validated, or, if not, the bonding structure is invalidated.