The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2011
Filed:
Jan. 29, 2008
Hiroshi Fukaya, Shatin, CN;
Satoshi Yamaguchi, Shatin, CN;
Hiroshi Fukaya, Shatin, CN;
Satoshi Yamaguchi, Shatin, CN;
SAE Magnetics (H.K.) Ltd., Hong Kong, HK;
Abstract
To improve the quality of the products that are manufactured by soldering, through enabling highly reliable soldering while suppressing damages to the bonding targets caused due to the soldering. Provided is a soldering method for bonding each of bonding pads formed in respective bonding targets with solder. The method comprises: a bonding target placing step for placing each of bonding targets to a bonding position; a soldering step for placing solder between each of the bonding pads formed in each of the bonding targets, and for performing soldering by irradiating a heating beam to the solder; and a bonding target heating step for heating at least one of the bonding targets, which is executed before the soldering step and/or simultaneously with the soldering step.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile