The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2011
Filed:
Nov. 18, 2009
Noboru Uehara, Okaya, JP;
Noboru Uehara, Okaya, JP;
Seiko Epson Corporation, , JP;
Abstract
In a wiring structure between steps in which a step portion is covered by an insulating slope formed by providing and drying droplets of an insulating ink in which an insulating material is dispersed in a dispersion medium and a wiring line formed by drying and firing provided droplets of a conductive ink in which a conductive material is dispersed in a dispersion medium is laid out between the steps and passes on a top surface of the insulating slope, the structure includes a liquid repellent layer formed of a liquid repellent material repelling the dispersion medium in the insulating ink, and a plurality of dot lines including a plurality of dots that is formed by hardening arranged droplets of a resin ink including a resin material. In the structure, the liquid repellent layer covers a surface including the step portion where the wiring line to be laid out. The droplets for forming the dot lines are arranged on a surface of the liquid repellent layer so as not to contact with each other in a region partitioned by a side serving as a start point and a side serving as an end point in a direction in which the wiring line is laid out. The insulating slope is formed by drying the droplets of the insulating ink provided to the step portion so as to connect the plurality of dot lines.