The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2011
Filed:
Feb. 19, 2009
Jean Brun, Champagnier, FR;
Benoît Lepine, Grenoble, FR;
Bruno Mourey, Coublevie, FR;
Dominique Vicard, Saint Nazaire les Eymes, FR;
Jean Brun, Champagnier, FR;
Benoît Lepine, Grenoble, FR;
Bruno Mourey, Coublevie, FR;
Dominique Vicard, Saint Nazaire les Eymes, FR;
Commissariat à l'Energie Atomique, Paris, FR;
Abstract
The method enables an assembly of chips, initially formed on a wafer, to be formed. Each chip comprises two parallel main faces joined by side faces. At least one of the side faces comprises at least one groove for housing a thread element. The wafer is first of all stuck onto a flexible film and the chips are then cut. The film is then deformed to space the chips apart from one another and to make the grooves accessible. A daisy chain is then formed joining the chips via at least one thread element, each chip being inserted in the daisy chain by inserting the thread in the groove of said chip and then removing the chip from the deformable film.