The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2011
Filed:
Aug. 27, 2010
Hidenori Miyakawa, Osaka, JP;
Shigeaki Sakatani, Osaka, JP;
Kumiko Sugiyama, Kanagawa, JP;
Takayuki Higuchi, Osaka, JP;
Atsushi Yamaguchi, Osaka, JP;
Hidenori Miyakawa, Osaka, JP;
Shigeaki Sakatani, Osaka, JP;
Kumiko Sugiyama, Kanagawa, JP;
Takayuki Higuchi, Osaka, JP;
Atsushi Yamaguchi, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A conductive bonding material having an improved preservation stability, and hardens when desired, preferably immediately hardens at a low temperature is provided. In one invention, the conductive bonding material comprises a conductive particle ingredient, an epoxy resin ingredient, and a hardening agent ingredient for said epoxy resin and the hardening agent ingredient for said epoxy resin further comprise a reforming agent having a thiol group. In another invention, a conductive bonding material comprising an epoxy resin hardening ingredient, wherein said epoxy resin hardening ingredient contains a sulfur-containing compound having an end group which can coordinate with a surface of the metallic particles, and the sulfur-containing compound comes to perform as a hardening agent for the epoxy resin by dissociating from the surface of the metallic particles. The conductive bonding material may contain fragrance.