The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2011
Filed:
Dec. 15, 2008
Applicants:
Seung Jin Lee, Balmain, AU;
Susan Williams, Balmain, AU;
Jan Waszczuk, Balmain, AU;
Kia Silverbrook, Balmain, AU;
Inventors:
Seung Jin Lee, Balmain, AU;
Susan Williams, Balmain, AU;
Jan Waszczuk, Balmain, AU;
Kia Silverbrook, Balmain, AU;
Assignee:
Silverbrook Research Pty Ltd, Balmain, New South Wales, AU;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41J 2/155 (2006.01); B41J 2/015 (2006.01);
U.S. Cl.
CPC ...
Abstract
A printhead assembly includes a molded ink manifold, a plurality of printhead integrated circuits, and an adhesive film sandwiched between the ink manifold and the printhead integrated circuits. A manifold bonding surface of the molded ink manifold includes a polymer coating. The polymer coating plugs fissures resulting from a molding process used to mold the ink manifold.