The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2011
Filed:
Aug. 17, 2009
Applicants:
Chin-jyi Wu, Hsinchu County, TW;
Chen-der Tsai, Hsinchu County, TW;
Yun-chuan Tu, Hsinchu County, TW;
Te-chi Wong, Chiayi County, TW;
Inventors:
Chin-Jyi Wu, Hsinchu County, TW;
Chen-Der Tsai, Hsinchu County, TW;
Yun-Chuan Tu, Hsinchu County, TW;
Te-Chi Wong, Chiayi County, TW;
Assignee:
Industrial Technology Research Institute, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01); B23Q 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of fabricating a clamping device for a flexible substrate is provided. A carrier board is provided. A plurality of holes is formed in the carrier board. A fixed positioning assembly and a movable positioning assembly are respectively embedded in the plurality of holes.