Probe card actuator

Abstract

A probe card test interface is described. The probe card test interface includes a first frame configured to support a probe card circuit card assembly (CCA). The probe card CCA is configured to contact a semiconductor wafer with one or more test probes. The first frame is also configured to support a first group of electrical contact points, the first group of electrical contact point being electrically coupled to circuitry of the probe card CCA. A second frame is coupled to a test interface CCA, where the test interface CCA includes a second group of electrical contact points. A number of actuation devices are slidably mounted on the second frame. The actuation devices have a tip member configured to engage a lip of the first frame when the corresponding actuation device is moved to an engagement position. When all of the actuation devices are in the engagement position, simultaneous actuation of the actuation devices moves the first frame toward the second frame to couple the first and second groups of electrical contact points. The first group of electrical contact points is supported by the first frame such that the probe card CCA experiences little or no deflection during actuation of the actuation devices, thereby preventing damage to the probe card CCA.