The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8008410 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 30, 2011

Filed:

Oct. 31, 2007
Applicants:

Takahiro Kotani, Tokyo, JP;

Yoshinori Nishitani, Tokyo, JP;

Daisuke Oka, Tokyo, JP;

Inventors:

Takahiro Kotani, Tokyo, JP;

Yoshinori Nishitani, Tokyo, JP;

Daisuke Oka, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08G 59/00 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
Abstract

There is provided an epoxy resin composition for encapsulating a semiconductor comprising an epoxy resin (A), wherein the epoxy resin (A) including: a crystalline epoxy resin (a1) having a melting point of 50° C. to 150° C., an epoxy resin (a2) represented by formula (1), and at least one epoxy resin (a3) selected from an epoxy resin represented by formula (2) and an epoxy resin represented by a formula (3): in which R1's, which may be the same or different, represent a hydrocarbon group having 1 to 4 carbon atoms; R2's, which may be the same or different, represent a hydrogen atom or a hydrocarbon group having 1 to 4 carbon atoms; m is an integer of 0 to 5; and n is an integer of 0 to 6.


Find Patent Forward Citations

Kotani, Takahiro. (2011). Epoxy resin composition for encapsulating semiconductor and semiconductor device (U.S. Patent No. 8008410). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8008410

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