The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2011
Filed:
Sep. 30, 2005
Toshiaki Takenaka, Kyoto, JP;
Yoshihiro Kawakita, Osaka, JP;
Tadashi Tojyo, Osaka, JP;
Yuichiro Sugita, Osaka, JP;
Toshiaki Takenaka, Kyoto, JP;
Yoshihiro Kawakita, Osaka, JP;
Tadashi Tojyo, Osaka, JP;
Yuichiro Sugita, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A method of manufacturing a multi-layer circuit board including preparing a laminated member formed of (i) a core circuit board having a circuit pattern thereon and (ii) a prepreg sheet having a through-hole filled with conductive paste, forming a laminated structure such that the laminated member is sandwiched by lamination plates, and applying heat and pressure to the laminated structure. According to this method, selecting a lamination plate that has a thermal expansion coefficient that is equivalent to that of a core circuit board will protect the conductive paste from distortion, thereby offering a high-quality multi-layer circuit board having a reliable connection resistance.