The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2011
Filed:
May. 24, 2006
Henry C. Abbink, Westlake Village, CA (US);
Gabriel M. Kuhn, West Hills, CA (US);
Howard GE, Alhambra, CA (US);
Daryl Sakaida, Simi Valley, CA (US);
Henry C. Abbink, Westlake Village, CA (US);
Gabriel M. Kuhn, West Hills, CA (US);
Howard Ge, Alhambra, CA (US);
Daryl Sakaida, Simi Valley, CA (US);
Northrop Grumman Systems Corporation, Los Angeles, CA (US);
Abstract
A method for optimizing direct wafer bond line width for reduction of parasitic capacitance in a MEMS device by reducing the width of a bond line between a first and a second wafer, exposing the MEMS device to a water vapor for a predetermined time period and at a first temperature capable of evaporating water, cooling the MEMS device at a second temperature capable of freezing the water, and operating the MEMS device at a third temperature capable of freezing the water to determine if there is discontinuity during operation.