The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2011

Filed:

May. 29, 2008
Applicant:

Alex Rutstein, Oberlin, OH (US);

Inventor:

Alex Rutstein, Oberlin, OH (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01F 3/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

In an improvement of the apparatus and method disclosed in U.S. Pat. No. 7,354,029 B1, a Process Fluid Treating Apparatus includes an ejector assembly fluidically connected to a process fluid supply assembly. A Coanda airfoil is located in the ejector assembly. Primary fluid is injected into the ejector duct and forms a Coanda layer, flowing adjacent to the walls of a Coanda Airfoil. A process fluid, or part of it, flows toward the ejector assembly through the Process Fluid Supply Assembly, which forces the process fluid to flow through a plurality of fluid ports to separate that process fluid into a plurality of separate streams and turns those separate streams of process fluid through its perforated tip towards the Coanda layer whereby the contact between the process fluid and the Coanda layer is controlled. Shear and other forces and pressure gradients associated with the Coanda layer serve to transport the process fluid from the source and to operate on the process fluid to atomize the process fluid and/or to de-agglomerize solid particles entrained in the process fluid. Alternatively, a mechanical pump could be used for process fluid delivery to the Coanda layer.


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