The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2011

Filed:

Mar. 02, 2006
Applicants:

Minoru Iizuka, Kakogawa, JP;

Tatsuya Murakami, Kakogawa, JP;

Syunsuke Satoh, Kakogawa, JP;

Takashi Shirai, Kakogawa, JP;

Hiroyuki Ishihara, Kakogawa, JP;

Tomo Fujii, Kakogawa, JP;

Inventors:

Minoru Iizuka, Kakogawa, JP;

Tatsuya Murakami, Kakogawa, JP;

Syunsuke Satoh, Kakogawa, JP;

Takashi Shirai, Kakogawa, JP;

Hiroyuki Ishihara, Kakogawa, JP;

Tomo Fujii, Kakogawa, JP;

Assignee:

Daishinku Corporation, Kakogawa-shi, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electrode forming region for providing lead electrodes () is provided on a crystal resonator plate (). Opposed side surfaces () of a substrate () are formed and inclined in the same direction with respect to a front major surface (). Also, an adhesion reinforcing portion () for reinforcing adhesion to a conductive adhesive () is provided in the electrode forming region for the lead electrodes (). For example, the adhesion reinforcing portion () is a notch portion which is cut and formed in the opposed side surfaces (). Thereby, an adhesion strength of the crystal resonator plate () and the conductive adhesive () is increased.


Find Patent Forward Citations

Loading…