The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2011
Filed:
Feb. 13, 2008
Shintaro Yamamichi, Tokyo, JP;
Katsumi Kikuchi, Tokyo, JP;
Jun Sakai, Tokyo, JP;
Hikaru Kouta, Tokyo, JP;
Shintaro Yamamichi, Tokyo, JP;
Katsumi Kikuchi, Tokyo, JP;
Jun Sakai, Tokyo, JP;
Hikaru Kouta, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A semiconductor device has an element interconnection, a top-layer element interconnection, a super-connect interconnectionand a bump. The element interconnectionis provided on a semiconductor substratethrough a plurality of insulating layers. The top-layer element interconnectionis formed above the element interconnectionby using a substantially equivalent process equipment. The super-connect interconnectionis provided on the top-layer element interconnectionthrough a super-connect insulating layerhaving a thickness five or more times larger than that of the insulating layer, and has a thickness three or more times larger than that of each the element interconnectionand the top-layer element interconnection. The bumpis formed on the super-connect interconnection. The top-layer element interconnectionhas a signal pad, a power source padand a ground pad. An area of the signal padis smaller than each area of the power source padand the ground pad