The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2011
Filed:
Jun. 25, 2008
Hisao Miura, Fukushima-ken, JP;
Shinji Murata, Fukushima-ken, JP;
Hisao Miura, Fukushima-ken, JP;
Shinji Murata, Fukushima-ken, JP;
Alps Electric Co., Ltd., Tokyo, JP;
Abstract
A multilayer ceramic circuit board includes ceramic wiring layers which are stacked together, one or two or more lifting layers which have a planar shape and which are disposed as an inner layer inside the stacked ceramic wiring layers or as a lower layer lower than a bottom ceramic wiring layer, and a protruding portion formed on a surface of a top ceramic wiring layer due to the disposition of the one or two or more lifting layers. The protruding portion smoothly protrudes and has a large area and high flatness. The multilayer ceramic circuit board is formed by disposing lifting layers as an inner layer of a plurality green sheets or as a lower layer lower than a bottom green sheet, and firing under pressure the resulting laminate in a state constrained by an elastic constraining sheet and a rigid constraining sheet.