The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2011
Filed:
Apr. 21, 2008
Takashi Sueyoshi, Tokyo, JP;
Ken-ichiro Hiwatari, Tokyo, JP;
Tadashi Janado, Tokyo, JP;
Yoshikazu Shoji, Tokyo, JP;
Seiichi Saito, Tokyo, JP;
Yoshitaka Sugawara, Hyogo, JP;
Takashi Sueyoshi, Tokyo, JP;
Ken-ichiro Hiwatari, Tokyo, JP;
Tadashi Janado, Tokyo, JP;
Yoshikazu Shoji, Tokyo, JP;
Seiichi Saito, Tokyo, JP;
Yoshitaka Sugawara, Hyogo, JP;
Adeka Corporation, Tokyo, JP;
Abstract
A silicon-containing compound of formula (1), and a curing composition containing a silicon-containing compound of formula (1) wherein Z is hydrogen, a silicon-containing compound of formula (1) wherein Z is C2-C4 alkenyl or alkynyl and a hydrosilylation catalyst. The composition has excellent handling and curing properties and provides a cured product with excellent heat resistance and flexibility. In formula (1), R-R=C1-C12 saturated aliphatic hydrocarbon group or C6-C12 aromatic hydrocarbon group. Rand Rdo not simultaneously represent C1-C12 saturated aliphatic hydrocarbon group; Y=C2-C4 alkylene; Z=hydrogen or C2-C4 alkenyl or alkynyl; K is 2-7; T is 1-7; P is 0-3; and M and N are numbers selected such that N:M=1:1 to 1:100, that all M's and N's total at least 15, and that the mass average molecular weight of the compound of formula (1) is 3,000 to 1,000,000.