The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8003513 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 23, 2011

Filed:

Mar. 22, 2005
Applicants:

Rajiv Shah, Rancho Palos Verdes, CA (US);

Shaun Pendo, Santa Maria, CA (US);

Inventors:

Rajiv Shah, Rancho Palos Verdes, CA (US);

Shaun Pendo, Santa Maria, CA (US);

Assignee:

Medtronic Minimed, Inc., Northridge, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

A multilayer circuit includes a dielectric base substrate, conductors formed on the base substrate and a vacuum deposited dielectric thin film formed over the conductors and the base substrate. The vacuum deposited dielectric thin film is patterned using sacrificial structures formed by electroplating techniques. Substrates formed in this manner enable significant increases in circuit pattern miniaturization, circuit pattern reliability, interconnect density and significant reduction of over-all substrate thickness.


Find Patent Forward Citations

Shah, Rajiv. (2011). Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures (U.S. Patent No. 8003513). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8003513

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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