The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2011
Filed:
Feb. 16, 2007
Hiroshi Sasaki, Mito, JP;
Makoto Kurosawa, Tokai, JP;
Kazuo Shimizu, Hitachinaka, JP;
Ricoh Printing Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;
Abstract
A substrate is provided on which wires can be formed satisfactorily using a dispersion liquid of metal microparticles without causing disconnection or short circuit. The wiring substrate comprises a substrate, an organic membrane formed on the substrate, and a metal wire formed on the organic membrane. An arithmetic mean deviation Ra of the profile of the surface of the organic membrane where the metal wire is formed is not less than 60 nm and not more than 5×10D, where D is the width of the metal wire. The contact angle with respect to water on the surface of the organic membrane where the metal wire is formed is not less than 110°.