The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2011
Filed:
Dec. 18, 2007
Chia-cheng Chen, Taoyuan, TW;
Chao-ching Wang, Taoyuan, TW;
Chiang-hua Huang, Taoyuan, TW;
Cheng-hsien Lin, Taoyuan, TW;
Chia-Cheng Chen, Taoyuan, TW;
Chao-Ching Wang, Taoyuan, TW;
Chiang-Hua Huang, Taoyuan, TW;
Cheng-Hsien Lin, Taoyuan, TW;
Foxconn Advanced Technology Inc., Tayuan, Taoyuan, TW;
Abstract
An exemplary method for manufacturing flexible printed circuit board is provided. A metal foil is supplied from a first feeding roller. The metal foil has a first surface and a second surface on two opposite sides of the metal foil. A first coverlay having a number of first openings defined therein is supplied from a second feeding roller and laminated on the first surface of the metal foil. Electrical traces are formed with the metal foil. A second coverlay having a number of second openings defined therein is supplied from a third feeding roller and laminated on the second surface of the metal foil. Each of the second openings registers with the respective first opening so that the electrical traces are exposed from the corresponding first and second openings. The method can improve quality and efficiency of manufacturing flexible printed circuit boards in a hollowed out form.