The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2011
Filed:
Aug. 29, 2006
Rajesh Kumar Malhan, Nagoya, JP;
C. Mark Johnson, Derbyshire, GB;
Cyril Buttay, Sheffield, GB;
Jeremy Rashid, Singapore, SG;
Florin Udrea, Cambridge, GB;
Rajesh Kumar Malhan, Nagoya, JP;
C. Mark Johnson, Derbyshire, GB;
Cyril Buttay, Sheffield, GB;
Jeremy Rashid, Singapore, SG;
Florin Udrea, Cambridge, GB;
DENSO CORPORATION, Kariya, JP;
University of Cambridge, Cambridge, GB;
The University of Sheffield, Sheffied, GB;
Abstract
A power electronic package includes: first and second high thermal conductivity insulating non-planar substrates; and multiple semiconductor chips and electronic components between the substrates. Each substrate includes multiple electrical insulator layers and patterned electrical conductor layers connecting to the electronic components, and further includes multiple raised regions or posts, which are bonded together so that the substrates are mechanically and electrically connected. The number, arrangement, and shape of the raised regions or posts are adjusted to have mechanical separation between the substrates. The electrical conductor layers are separated and isolated one another so that multiple electric circuits are provided on at least one of the substrates.