The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2011
Filed:
Oct. 22, 2009
Applicants:
Jong-jin Lee, Gwangju-si, KR;
Hyun-seo Kang, Gwangju-si, KR;
Jai-sang Koh, Gwangju-si, KR;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
Abstract
Disclosed is a method of manufacturing a through-via. The through-via manufacturing method includes forming a core-via hole in a wafer, forming a suction-via hole adjacent to the core-via hole in the wafer, forming a via core in the core-via hole, forming a polymer-via hole connected to the suction-via hole in the wafer, filling the polymer-via hole with polymer solution by creating a vacuum inside the polymer-via hole by drawing air out of the suction-via hole, and polishing the wafer such that the via core formed in the core-via hole is exposed.