The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2011
Filed:
Jun. 17, 2010
Fujio Ito, Hanno, JP;
Hiromichi Suzuki, Tokyo, JP;
Akihiko Kameoka, Ogose, JP;
Noriaki Sakamoto, Kodaira, JP;
Fujio Ito, Hanno, JP;
Hiromichi Suzuki, Tokyo, JP;
Akihiko Kameoka, Ogose, JP;
Noriaki Sakamoto, Kodaira, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
A method for manufacturing a semiconductor device includes mounting a first chip over a first area of a chip mounting section of a lead frame and mounting a second chip over a second area of the chip mounting section, wherein the second area is adjacent to the first area via the slit. The chip mounting section is disposed on a flat heating jig. First pads of the first chip are connected with second pads of the second chip via first wires, respectively, and the first pads are connected with leads of the lead frame via second wires, respectively. the first chip, the second chip, the first wires and the second wires are sealed with a resin such that a part of each of the leads is exposed from the resin, and each of the leads is then separated from the lead frame.