The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2011
Filed:
May. 02, 2009
Takashi Sato, Tokyo, JP;
Junichi Takano, Tokyo, JP;
Takashi Sato, Enzan, JP;
Tokuo Naitou, Enzan, JP;
Takashi Sato, Tokyo, JP;
Junichi Takano, Tokyo, JP;
Takashi Sato, Enzan, JP;
Tokuo Naitou, Enzan, JP;
Renesas Electronics Corporation, Kawasaki-shi, JP;
Abstract
Illumination devices () and () which irradiate light having a wavelength of 1.1 μm or less are arranged on a front surface and a rear surface of a cover () of a dicing device (). After a wafer is placed on a dicing stage (), when the wafer is diced by a blade () attached to a spindle (), light is irradiated on an entire surface of an upper surface (element forming surface) of the wafer by the illumination devices () and (). At this time, an illuminance of light on the wafer is set at 70 lux or more and 2000 lux or less. By this means, during a dicing operation, an area to be a light-shielded area by the spindle () or the like is not present on the wafer.