The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2011

Filed:

May. 19, 2008
Applicants:

Nicholas X. Fang, Champaign, IL (US);

Placid M. Ferreira, Champaign, IL (US);

Keng Hao Hsu, Savoy, IL (US);

Peter Lee Schultz, Urbana, IL (US);

Kyle E. Jacobs, Urbana, IL (US);

Anil Kumar, Champaign, IL (US);

Inventors:

Nicholas X. Fang, Champaign, IL (US);

Placid M. Ferreira, Champaign, IL (US);

Keng Hao Hsu, Savoy, IL (US);

Peter Lee Schultz, Urbana, IL (US);

Kyle E. Jacobs, Urbana, IL (US);

Anil Kumar, Champaign, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/02 (2006.01); C25D 17/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed herein are electrochemical fabrication platforms for making structures, arrays of structures and functional devices having selected nanosized and/or microsized physical dimensions, shapes and spatial orientations. Methods, systems and system components use an electrochemical stamping tool such as solid state polymeric electrolytes for generating patterns of relief and/or recessed features exhibiting excellent reproducibility, pattern fidelity and resolution on surfaces of solid state ionic conductors and in metal. Electrochemical stamping tools are capable high throughput patterning of large substrate areas, are compatible with commercially attractive manufacturing pathways to access a range of functional systems and devices including nano- and micro-electromechanical systems, sensors, energy storage devices, metal masks for printing, interconnects, and integrated electronic circuits.


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