The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7997199 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 16, 2011

Filed:

Jun. 10, 2008
Applicants:

Miyoshi Watanabe, Fuji, JP;

Tomohiro Kishida, Fuji, JP;

Inventors:

Miyoshi Watanabe, Fuji, JP;

Tomohiro Kishida, Fuji, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F 7/26 (2006.01);
U.S. Cl.
CPC ...
Abstract

A workpieceis set to holding rotating means and then liquid-state photosensitive resinis supplied to a resin applying smoothing unitto mold the workpieceinto a uniform thickness while rotating the workpieceand applying the liquid-state photosensitive resinto the outer periphery of the workpieceby the resin applying smoothing unit. Moreover, while rotating the workpiece, liquid-state photosensitive resin, it is exposed by high-intensity ultraviolet lightand thereby, the surface of the photo-cured photosensitive resin is shaped to remove an unnecessary resin layer. Then, laser carving is performed by an infrared laser beamto perform post-treatment.


Find Patent Forward Citations

Watanabe, Miyoshi. (2011). Method and apparatus for manufacturing relief material for seamless printing (U.S. Patent No. 7997199). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7997199

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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