The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2011
Filed:
Feb. 06, 2008
Applicant:
David Kwong, Fremont, CA (US);
Inventor:
David Kwong, Fremont, CA (US);
Assignee:
Electronics for Imaging, Inc., Foster City, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
Methods and apparatus are provided for designing and laying out multi-layer circuit substrates, such as multi-layer PCBs. Dynamic vias are provided on intermediate PCB layers. Each dynamic via has features that adjust based on the trace layout of the corresponding intermediate layer. In particular, each dynamic via has a second radius Rif the via is not connected to any trace on the corresponding intermediate layer. If a trace is connected to a dynamic via, the via radius changes from the second radius Rto a first radius R, where Ris greater than R