The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2011

Filed:

May. 09, 2008
Applicants:

Yoshihiro Tomura, Osaka, JP;

Kazuhiro Nobori, Osaka, JP;

Yuichiro Yamada, Osaka, JP;

Kentaro Kumazawa, Osaka, JP;

Teppei Iwase, Hyogo, JP;

Inventors:

Yoshihiro Tomura, Osaka, JP;

Kazuhiro Nobori, Osaka, JP;

Yuichiro Yamada, Osaka, JP;

Kentaro Kumazawa, Osaka, JP;

Teppei Iwase, Hyogo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/488 (2006.01);
U.S. Cl.
CPC ...
Abstract

In this semiconductor chip, a table electrodeis interposed between a bump electrodeand an electrode pad. The table electrodeis formed by forming a plurality of coreshaving a smaller Young's modulus than the bump electrode, on the electrode pad, and then covering the surfaces of the coreswith a conductive electrode. When the semiconductor chipis flip-chip mounted, the bump electrodeis plastically deformed and the table electrodeis elastically deformed appropriately, thereby obtaining a good conductive state.


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