The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2011

Filed:

Sep. 05, 2008
Applicant:

Young Suk Kim, Kawasaki, JP;

Inventor:

Young Suk Kim, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0328 (2006.01); H01L 31/0336 (2006.01); H01L 31/072 (2006.01); H01L 31/109 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device to which a stress technique is applied and in which a leakage current caused by silicidation can be suppressed. A gate electrode is formed over an element region defined by an isolation region formed in a semiconductor substrate with a gate insulating film between. Extension regions and source/drain regions are formed in the element region on both sides of the gate electrode. In addition, a semiconductor layer which differs from the semiconductor substrate in lattice constant is formed apart from at least part of the isolation region. By doing so, the formation of a spike near the isolation region is suppressed even if a silicide layer is formed. Accordingly, a leakage current caused by such a spike can be suppressed.


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