The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2011
Filed:
Dec. 04, 2007
Aya Hino, Kobe, JP;
Katsufumi Tomihisa, Kobe, JP;
Hiroshi Gotou, Kobe, JP;
Takashi Onishi, Kobe, JP;
Aya Hino, Kobe, JP;
Katsufumi Tomihisa, Kobe, JP;
Hiroshi Gotou, Kobe, JP;
Takashi Onishi, Kobe, JP;
Kobe Steel, Ltd., Kobe-shi, JP;
Abstract
An object of the present invention is to provide: a Cu alloy wiring film that makes it possible to use Cu having a low electrical resistivity as a wiring material, exhibit a high adhesiveness to a glass substrate, and avoid the danger of peel off from the glass substrate; a TFT element for a flat-panel display produced with the Cu alloy wiring film; and a Cu alloy sputtering target used for the deposition of the Cu alloy wiring film. The present invention is a wiring filmcomposing a TFT elementfor a flat-panel display and a sputtering target used for the deposition of the film and the material comprises Cu as the main component and at least one element selected from the group consisting of Pt, Ir, Pd, and Sm by 0.01 to 0.5 atomic percent in total. The wiring filmis layered on a glass substrateand further a transparent conductive filmis layered thereon while an insulating filmis interposed in between.