The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2011
Filed:
Sep. 27, 2004
Applicant:
Norifumi Tokuda, Tokyo, JP;
Inventor:
Norifumi Tokuda, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/461 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor manufacturing apparatus and a semiconductor manufacturing method, and has as one object to process a wafer easily and stably irrespective of thickness. To achieve the above object, a semiconductor manufacturing apparatus includes: an open-topped cassette that encases a semiconductor substrate; a plurality of processors for performing a predetermined processing of the semiconductor substrate; and a transporting mechanism that transports the cassette encasing the semiconductor substrate between the plurality of processors.