The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2011

Filed:

Mar. 27, 2009
Applicants:

Tae-hyung Hwang, Seoul, KR;

Hyun-jae Kim, Seoul, KR;

Do-kyung Kim, Yongin-si, KR;

Woong-hee Jeong, Seoul, KR;

Choong-hee Lee, Suwon-si, KR;

Tae-hun Jung, Seoul, KR;

Inventors:

Tae-Hyung Hwang, Seoul, KR;

Hyun-Jae Kim, Seoul, KR;

Do-Kyung Kim, Yongin-si, KR;

Woong-Hee Jeong, Seoul, KR;

Choong-Hee Lee, Suwon-si, KR;

Tae-Hun Jung, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/84 (2006.01); H01L 21/20 (2006.01); H01L 21/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of crystallizing amorphous silicon comprises forming an amorphous silicon layer on a substrate; forming an insulating layer on the amorphous silicon layer; forming a heat distributing metal layer on the insulating layer; and forming a thermite layer on the heat distributing metal layer. Ignition heat is then applied to ignite the thermite layer and generate sufficient localized exothermic heat from the ignited thermite layer so as to crystallize the amorphous silicon layer. The substrate beneath the amorphous silicon layer can be a heat sensitive substrate which is not substantially deformed by the localized crystallizing heat applied to the top portion of the amorphous silicon layer by way of the heat distributing metal layer and the insulating layer.


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