The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2011
Filed:
May. 07, 2009
Yuko Sato, Kanagawa, JP;
Yuko Sato, Kanagawa, JP;
Renesas Electronics Corporation, Kawasaki-shi, Kanagawa, JP;
Abstract
A method of manufacturing a semiconductor device capable of obtaining high joining force between a heat spreader and resin is provided. The method of manufacturing a semiconductor device according to the present invention includes: setting a heat spreaderon a face formed a plurality of aperturesin a cavityof a first molding die; filling resininto the cavity; setting a substratemounted with a semiconductor chipa second molding die; and pressure-welding the first molding dieand the second molding dieso that the semiconductor chip is embedded in the resin, wherein a plurality of concave portion is formed on one face of the heat spreader, a plurality of convex portions is formed on the other face of the heat spreader, and the plurality of concave portions and the plurality of convex portions are overlapped in plan view.