The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2011
Filed:
Sep. 24, 2008
Masahiro Sekiguchi, Yokohama, JP;
Eiji Takano, Yokohama, JP;
Tatsuhiko Shirakawa, Mitaka, JP;
Kenichiro Hagiwara, Yokohama, JP;
Masayuki Dohi, Yokohama, JP;
Susumu Harada, Yokohama, JP;
Masahiro Sekiguchi, Yokohama, JP;
Eiji Takano, Yokohama, JP;
Tatsuhiko Shirakawa, Mitaka, JP;
Kenichiro Hagiwara, Yokohama, JP;
Masayuki Dohi, Yokohama, JP;
Susumu Harada, Yokohama, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A method for manufacturing a semiconductor device, includes: preparing a semiconductor substrate with a first notch; preparing a supporting substrate with a second notch; laminating the semiconductor substrate with the supporting substrate so that the first notch can be matched with the second notch; and processing a second main surface of the semiconductor substrate opposite to a first main surface thereof facing to the supporting substrate to reduce a thickness of the semiconductor substrate to a predetermined thickness.