The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2011
Filed:
Nov. 06, 2008
Joseph Damian Gordon Lacey, Milpitas, CA (US);
Mickael Renault, San Jose, CA (US);
Vikram Joshi, Mountain View, CA (US);
James F. Bobey, Morgan Hill, CA (US);
Robertus P. Van Kampen, s-Hertogenbosch, NL;
Joseph Damian Gordon Lacey, Milpitas, CA (US);
Mickael Renault, San Jose, CA (US);
Vikram Joshi, Mountain View, CA (US);
James F. Bobey, Morgan Hill, CA (US);
Robertus P. Van Kampen, s-Hertogenbosch, NL;
Cavendish Kinetics, Ltd., Hertfordshire, GB;
Abstract
Embodiments discussed herein generally include methods of fabricating MEMS devices within a structure. The MEMS device may be formed in a cavity above the structure, and additional metallization may occur above the MEMS device. The cavity may be formed by depositing an encapsulating layer over the sacrificial layers that enclose the MEMS device. The encapsulating layer may then be etched to expose portions of the sacrificial layers. The sacrificial layers are exposed because they extend through the sidewalls of the encapsulating layer. Therefore, no release holes are etched through the top of the encapsulating layer. An etchant then removes the sacrificial layers to free the MEMS device and form the cavity and an opening through the sidewall of the encapsulating layer. Another encapsulating layer may then be deposited to seal the cavity and the opening.