The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2011

Filed:

Aug. 07, 2007
Applicants:

Hariklia Deligianni, Tenafly, NJ (US);

Laertis Economikos, Wappingers Falls, NY (US);

Catherine Ivers, Hopewell Junction, NY (US);

Xiaoyan Shao, Yorktown Heights, NY (US);

Inventors:

Hariklia Deligianni, Tenafly, NJ (US);

Laertis Economikos, Wappingers Falls, NY (US);

Catherine Ivers, Hopewell Junction, NY (US);

Xiaoyan Shao, Yorktown Heights, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An apparatus and method designed to remove metals from a wafer surface using an electrolytic removal process. The apparatus includes a conductive pad having a plurality of alternating cathodes and anodes provided with a power source. The conductive pad is structured and configured to contact all metal islands on a surface of the wafer. Gaps are provided between pairs of the plurality of alternating cathodes and anodes.


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