The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2011

Filed:

Jan. 22, 2007
Applicants:

Chul-jong Han, Anyang-si, KR;

Yoon-jae Chung, Anyang-si, KR;

Jong-yoon Jang, Anyang-si, KR;

Jeong-beom Park, Anyang-si, KR;

Yong-seok Han, Anyang-si, KR;

Sung-uk Choi, Anyang-si, KR;

Il-rae Cho, Anyang-si, KR;

Hyuk-soo Moon, Anyang-si, KR;

Kyung-joon Lee, Anyang-si, KR;

Inventors:

Chul-Jong Han, Anyang-si, KR;

Yoon-Jae Chung, Anyang-si, KR;

Jong-Yoon Jang, Anyang-si, KR;

Jeong-Beom Park, Anyang-si, KR;

Yong-Seok Han, Anyang-si, KR;

Sung-Uk Choi, Anyang-si, KR;

Il-Rae Cho, Anyang-si, KR;

Hyuk-Soo Moon, Anyang-si, KR;

Kyung-Joon Lee, Anyang-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 μm due to dents formed by heat-compression.


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