The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2011
Filed:
Mar. 05, 2008
Tim Tuan, San Jose, CA (US);
Kerry M. Pierce, Edmonds, WA (US);
Albert Franceschino, Yardley, PA (US);
Tim Tuan, San Jose, CA (US);
Kerry M. Pierce, Edmonds, WA (US);
Albert Franceschino, Yardley, PA (US);
Xilinx, Inc., San Jose, CA (US);
Abstract
Power management with a packaged multi-die integrated circuit (IC) is described. A first integrated circuit die is capable of a first operational mode. A second integrated circuit die is coupled to the first integrated circuit die. The first integrated circuit die has a rate of power consumption that is lower than the second integrated circuit die when the first integrated circuit die is in the first operational mode and the second integrated circuit die is in a second operational mode. The first integrated circuit die is configured for power management of the second integrated circuit die for placing the second integrated circuit die in a standby mode from the second operational mode and for returning the second integrated circuit die to the second operational mode from the standby mode.