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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7991497 B1

PDFFull Text
Date of Patent:
Aug. 02, 2011

Filed:

Oct. 27, 2008

Method and system for defect detection in manufacturing integrated circuits

Applicants:

Paul Kuang-chi Lin, Shanghai, CN;

Sophia Zhang, Shanghai, CN;

Inventors:

Paul Kuang-Chi Lin, Shanghai, CN;

Sophia Zhang, Shanghai, CN;

Assignee:

Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;

Attorney:

Kilpatrick Townsend and Stockton LLP

Primary Examiner:

Michael D Masinick

Int. Cl.
CPC ...
G06F 19/00 (2011.01);
U.S. Cl.
CPC ...
Abstract

Method and system for defect detection in manufacturing integrated circuits. In an embodiment, the invention provides a method for identifying one or more sources for possible causing manufacturing detects in integrated circuits. The method includes a step for providing a plurality of semiconductor substrates. The method includes a step for processing the plurality of semiconductor substrates in a plurality of processing steps using a plurality of processing tools. The method additionally includes a step for providing a database, which includes data associated with the processing of the plurality of semiconductor substrates. The method further includes a step for testing the plurality of semiconductor wafers after the processing of the plurality of semiconductor substrates. Additionally, the method includes a step for detecting at least one defect characteristic associated with the plurality of the semiconductor substrates that have been processed. Moreover, the method includes a step for identifying a set of processing steps. For example, the set of processing step are possibly associated with the defect characteristic.

Find Patent Forward Citations

Lin, Paul Kuang-Chi. (2011). Method and system for defect detection in manufacturing integrated circuits (U.S. Patent No. 7991497). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7991497

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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