The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2011
Filed:
Nov. 02, 2007
Hyun-seok Choi, Chungcheongnam-do, KR;
Hyung-mo Hwang, Chungcheongnam-do, KR;
Yong-hyun Kim, Gyeonggi-do, KR;
Hyo-jae Bang, Chungcheongnam-do, KR;
Su-yong an, Chungcheongnam-do, KR;
Hyun-Seok Choi, Chungcheongnam-do, KR;
Hyung-Mo Hwang, Chungcheongnam-do, KR;
Yong-Hyun Kim, Gyeonggi-do, KR;
Hyo-Jae Bang, Chungcheongnam-do, KR;
Su-Yong An, Chungcheongnam-do, KR;
Samsung Electronics Co., Ltd., Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Abstract
A semiconductor memory module having a reverse mounted chip resistor, and a method of fabricating the same are provided. By reverse mounting the chip resistor on the semiconductor memory module, the resistive material is protected, thereby preventing open circuits caused by damage to the resistive material. Also, a chip-resistor connection pad of a module substrate is formed to extend higher from the module substrate than other connection pads connected to other elements. Thus, the resistive material of the chip resistor does not contact the module substrate, thereby preventing poor alignment and defective connections.