The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2011
Filed:
Feb. 11, 2008
Klaas Heres, Berkel en Rodenrijs, NL;
Paul Dijkstra, Eindhoven, NL;
Maarten Nollen, Eindhoven, NL;
NXP B.V., Eindhoven, NL;
Abstract
A carrier () for bonding a semiconductor chip () onto is provided, wherein the carrier () comprises a die pad () and a plurality of contact pads (), wherein each of the plurality of contact pads () comprises an electrically conductive multilayer stack, wherein the electrically conductive multilayer stack comprises a surface layer (), a first buffer layer, and a first conductive layer (). Furthermore, the first buffer layer comprises a material adapted to prevent diffusion of material of the surface layer () into the first conductive layer (), and at least two of the contact pads () has an ultrafine pitch relative to each other.